Technology trends

Market and Technology Trends in Advanced Semiconductor Packaging: IDTechEx Webinar

Today, data is exploding at every level and in almost every industry. Machine learning and AI are crucial data enablers in a wide range of applications, including data centers, 5G, and self-driving cars. To run these programs, a powerful processor is needed, with an integrated circuit (IC) made on Si serving as the basis.

For decades, the IC design house has built a chip with all the functionality built into a single chip; however, as Moore’s Law slows down (chip density no longer doubles every two years), scaling monolithic ICs becomes increasingly complex and expensive. This forces IC manufacturers to seek out “advanced semiconductor packaging technologies”. Compared to conventional packaging technologies, advanced semiconductor packaging technologies, such as 2.5DIC and 3DIC, promise higher chip connection and lower power consumption, enabling the IC vendor to continue to provide high performance chips at a reasonable price.

In this webinar, Dr. Yu-Han Chang will present IDTechEx’s latest data and insights for the advanced semiconductor packaging industry, which will include research from IDTechEx’s latest market study “Advanced Semiconductor Packaging 2023-2033”.

This webinar will provide an overview of the current state of the advanced semiconductor packaging industry. Content includes:

  • Analysis of Advanced Semiconductor Packaging Markets and their Mid to Long Term Opportunity
  • Key Application Growth Drivers
  • Player analysis – the battlefield dynamics of advanced semiconductor packaging
  • Advanced semiconductor packaging technologies – current challenges and innovative trends