23-08-2022 | IDTechEx | Submarines and systems
In this webinar, Dr. Yu-Han Chang will present IDTechEx’s latest data and insights for the advanced semiconductor packaging industry, including research from IDTechEx’s latest market study, “Advanced Semiconductor Packaging 2023 -2033”. This webinar takes place on Thursday, August 25, 2022 for 30 minutes.
Data is exploding at every level and in almost every industry. ML and AI are essential data enablers in many applications, including data centers, 5G, and self-driving cars. A powerful processor is needed to run these programs, with an integrated circuit made on Si serving as the basis.
For decades, the IC design house has created a chip with all functionality built into a single chip; However, as Moore’s Law slows down (chip density no longer doubles every two years), scaling monolithic ICs becomes increasingly complex and expensive. This forces IC manufacturers to follow “advanced semiconductor packaging technologies”. Compared with traditional packaging technologies, advanced semiconductor packaging technologies, such as 2.5DIC and 3DIC, promise higher chip connection and lower power consumption, enabling the IC vendor to continue to provide high performance chips at a reasonable price.
This webinar will provide an overview of the current state of the advanced semiconductor packaging industry, including an analysis of the advanced semiconductor packaging markets and their medium to long-term opportunities; key application growth drivers; player analysis – the battlefield dynamics of advanced semiconductor packaging; and advanced semiconductor packaging technologies – current challenges and innovative trends.